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1. Jang, S., Kulkarni, A., Qin, H., and Kim, T. (2016). "Note: Evaluation of slurry particle size analyzers for chemical mechanical planarization process." Review of Scientific Instruments, 87(4), 046101. AIP Publishing.
A direct comparison of SMPS and DLS for PSD measurement of CMP slurries, with TEM used as the reference standard. SMPS resolved bimodal particle sizes at 30 nm and 80 nm closely matching TEM results, while DLS showed only a single mode in the 90–100 nm range and could not detect smaller particles. Concludes that SMPS is the superior choice for CMP slurry particle size and concentration measurement.
https://pubs.aip.org/aip/rsi/article-abstract/87/4/046101/361165/Note-Evaluation-of-slurry-particle-size-analyzers
Also available via PubMed: https://pubmed.ncbi.nlm.nih.gov/27131717/
2. Kwak, D., Kim, J., Oh, S., Bae, C., and Kim, T. (2020). "Application of electrospray-scanning mobility particle sizer for the measurement of sub-10 nm chemical mechanical planarization slurry abrasive size distribution." Review of Scientific Instruments, 91(7), 075117. AIP Publishing.
An SMPS was used for measuring the size of sub-10 nm CMP slurry abrasives, with both an atomizer and electrospray used for aerosolization. The electrospray-SMPS (ES-SMPS) measurement matched TEM analysis without the agglomeration artifact introduced by the atomizer's larger droplet size. Demonstrates SMPS suitability for the finest abrasive fractions relevant to advanced node CMP.
https://pubs.aip.org/aip/rsi/article-abstract/91/7/075117/967937/Application-of-electrospray-scanning-mobility
3. Lee, J., He, S., Song, G., and Hogan, C. J. Jr. (2022). "Size distribution monitoring for chemical mechanical polishing slurries: An intercomparison of electron microscopy, dynamic light scattering, and differential mobility analysis." Powder Technology, 396, 395–406. ScienceDirect/Elsevier.
Evaluates aerosol-based differential mobility analysis (via liquid nanoparticle sizer) against EM and DLS for eight distinct CMP slurry types — silica, alumina, TiO₂, ZrO₂, and ceria. LNS measurements were more repeatable than DLS measurements, and for four silica slurries, LNS distributions were in better agreement with SEM measurements than DLS. The LNS was also found to quantify multimodal size distributions.
https://www.sciencedirect.com/science/article/abs/pii/S003259102100927X
4. Kwak, D., Kim, J., Oh, S., Bae, C., and Kim, T. (2023). "Size distribution measurement of mixed abrasive slurry for chemical mechanical planarization using an electrospray scanning mobility particle sizer." Colloids and Surfaces A: Physicochemical and Engineering Aspects. ScienceDirect/Elsevier.
Extends ES-SMPS methodology to mixed abrasive slurries (MAS), demonstrating number concentration and mixing ratio analysis. The effectiveness of DLS is limited when measuring a bimodal slurry, and it cannot be used to measure the total number of slurry abrasives in solution. Demonstrates that number concentration-based MAS analysis via ES-SMPS improves copper CMP removal rate prediction.
https://www.sciencedirect.com/science/article/abs/pii/S0927775723008828
5. Rahman, M. et al. (2024). "Electrospray-Scanning Mobility Particle Sizer (ES-SMPS) Technique: Superior Sizing and Multimodal Characterization of Colloidal Nanoparticles Compared to NTA and DLS." Analytical Chemistry, 96(48), 18946–18956. ACS Publications. Particle Technology Laboratory, University of Minnesota.
Benchmarks ES-SMPS against nanoparticle tracking analysis (NTA) and DLS for multimodal colloidal samples including CMP-relevant nanoparticles. The ES-SMPS approach identified particle peaks in multimodal (bimodal, trimodal, and tetramodal) samples and showed the accurate position of mode diameter, while DLS and NTA have weaknesses in characterizing multimodal samples. NTA cannot measure silica particles smaller than 30–40 nm, whereas ES-SMPS is independent of optical properties.
https://pubs.acs.org/doi/10.1021/acs.analchem.4c02891
Also available via ResearchGate: https://www.researchgate.net/publication/386016398
6. Hojoong KimHo et al. (2010). "Measurement of CMP Slurry Abrasive Size Distribution by Scanning Mobility Particle Sizer." ResearchGate / Conference Proceedings.
Early demonstration of SMPS for SiO₂ and CeO₂ CMP slurry abrasive sizing. Proposes SMPS as a superior alternative to laser light scattering due to its use of electrical mobility classification and single-particle counting, which provides more precise results for polydisperse abrasive particles.
https://www.researchgate.net/publication/244672012_Measurement_of_CMP_Slurry_Abrasive_Size_Distribution_by_Scanning_Mobility_Particle_Sizer
7. Seongmin Cho et al. (2026). "Liquid particle monitoring system utilizing aerosol metrology and data processing algorithm: chemical mechanical polishing slurry application." Measurement, ScienceDirect/Elsevier (2025).
Most recent peer-reviewed work integrating an atomizer-SMPS (A-SMPS) framework with a multi-stage inversion algorithm for inline CMP slurry monitoring. Aerosol detection techniques such as the SMPS have emerged as pivotal tools for characterizing nanoparticles in a variety of applications, including CMP slurry analysis. Establishes a practical measurement framework that overcomes limitations of DLS, at-line DLS, and single-particle optical sensing (SPOS) for continuous process monitoring.
https://www.sciencedirect.com/science/article/abs/pii/S0263224125029835
Supplementary Reference
OSTI.GOV (U.S. Department of Energy). Note: Evaluation of slurry particle size analyzers for chemical mechanical planarization process — Record. DOE Office of Scientific and Technical Information.Government science database record for the Jang et al. (2016) Review of Scientific Instruments article (item 5 above), providing an independent archival record and abstract.
https://www.osti.gov/biblio/22597147
Note: Where journal articles are behind a paywall, ResearchGate and OSTI links are provided as open-access alternatives where available. Full-text access may require institutional subscriptions to AIP Publishing, ACS Publications, or Elsevier/ScienceDirect.