Wafer Qual-Dep™ Qualification Contamination Standards are built to customer specifications, typically after a tool or process has been developed using Dev-Dep™ Development Contamination Standards. The same customizable attributes available for Dev-Dep™ Development Contamination Standards are also available for each deposit made on your substrate of choice:
- Deposit Pattern Type
- Deposit Size and Position
- Particle Material
- Particle Size
- Particle Count
Applications
- Wafer inspection tool qualification
- Wafer inspection tool traceable calibration
Substrates
Deposits can be made on a range of wafer types, including bare silicon wafers or customer-provided wafers with films, patterns, or proprietary specifications. While MSP typically provides bare silicon wafers for deposition, we also accommodate custom requests to ensure that our solutions meet your specific needs.
| Substrate Type | MSP-Supplied Substrate Sizes | Customer-Supplied Substrate Sizes |
|---|---|---|
| Bare Silicon Wafer | 200 mm, 300 mm | 100 mm*, 150 mm*, 200 mm, 300 mm |
| Glass Wafer | 200 mm*, 300 mm* | 100 mm*, 150 mm*, 200 mm*, 300 mm* |
| Sapphire Wafer | 100 mm*, 150 mm*, 200 mm* | 100 mm*, 150 mm*, 200 mm* |
| SiC Wafer | N/A | 100 mm*, 150 mm* |
| GaAs Wafer | N/A | 100 mm*, 150 mm* |
| Film or Patterned Wafer | N/A | 100 mm*, 150 mm*, 200 mm, 300 mm |
* Non-standard substrate, processing of which may be subject to additional fees.
Deposits
Each deposit can be customized with a number of attributes from the selections listed in the following table. Restrictions apply to some combinations of attribute selections.
- Pattern Type: Spot, Full, Arc, Ring
- Particle Type / Material:
- PSL Spheres (Size Standards)
- SiO2 Spheres (including MSP NanoSilica™ Size Standards)
- MSP Process Particles™ Suspensions (AlF3, Al2O3, Ni, Ru, Si, Si3N4, SiO2, Sn, Ta, Ti, TiN, TiO2, W, Y2O3)
- Particle Size: 10 nm – 20 μm (All-inclusive particle size range. Restrictions apply to each particle type/material.)
- Particle Count: Minimum 100 particles per deposit
- Pattern Width: Typically 10-30 mm; Range of Pattern Width (e.g., Spot Diameter) is dependent on Particle Size
- Pattern Location: Substrate-dependent
Features & Benefits
Wafer Qual-Dep™ Qualification Contamination Standards offer distinct advantages for wafer-based equipment suppliers and fabs:
- Exclusivity: Each Qual-Dep™ standard is sold with a dedicated part number, ensuring unique specifications and streamlining the ordering process for consistent results.
- Supply Chain Integration: MSP collaborates with your supply chain to simplify purchasing, minimize substrate transport, and expedite delivery of Qual-Dep™ Qualification Wafer Contamination Standards.
- Record Management: MSP’s system meticulously tracks deposition recipe revisions and monitors key particle deposition parameters, ensuring quality assurance and traceability.
- Flexible Terms: MSP negotiates beneficial terms including quantity, pricing, and lead times tailored to your needs.
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