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Liquid Source Vaporization in Gas-Phase Processing

Thin Film Deposition & Removal

Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) represent crucial stages in microelectronic device fabrication, where hundreds of process steps are required that need multiple nanometer- to micron-thick thin films. Those are deposited and then partially stripped away to leave extremely complex 3D structures. Vaporizers are a critical component in semiconductor fabrication.

Silicon wafer in a clean processing room being hold by an engineer

Vapor Delivery for CVD, ALD and Etch

CVD (Chemical Vapor Deposition) and ALD (Atomic Layer Deposition) are two widely used methods to create thin films. CVD and ALD are gas phase processes. When CVD or ALD chemistry requires the use of a material that is typically in liquid form, a vaporizer is used to phase-change the liquid into a gas. CVD/ALD thin film deposition, doped-epitaxial growth, and metal etch often require a vapor with extremely stable concentration and stable chemical stoichiometry.

Higher Throughput and Better Yield

MSP's exclusive technology offers a broad range of advantages over older, more conventional techniques. The development of our new line of vaporization solutions is inspired by breakthroughs in the science of droplet atomization and use a direct liquid injection (DLI) technique. Designed to meet modern demanding vaporization needs, these innovative vaporizers are half the physical footprint of earlier versions, while delivering a staggering 200% increase in vapor output.

Delivering Consistent Thin Film Deposition

MSP, a Division of TSI, offers the widest range of standard vaporizer solutions commercially available. Every year our MSP vaporization experts continue to innovate and drive vaporization technology to new heights to meet the demands of progressively challenging process requirements. With 40+ active design patents, MSP continues to be a leader in vapor delivery solutions. MSP provides three key components of a vaporization system: vaporizers, vapor filters, and liquid flow controllers.

Advanced Vaporization Technology

Better Vaporization, More Process Options
Twice the Output, Half the Size
Difficult (and Easy) to Vaporize Liquids

Better Vaporization, More Process Options

MSP's new vaporization technique is based on droplet vaporization, direct liquid injection (DLI) method designed to meet modern demanding vaporization needs. The stable and uniform vapor leads to a higher quality thin film and higher wafer yields. The precision and control of the vaporizer makes it possible to vaporize difficult precursors, which were not usable before, opening up new areas for process development. The unique design provides highly reliable, stable operation resulting in less downtime and more money saved for users.

Twice the Output, Half the Size

The implemented heat exchanging method was the result of focused research on optimizing heat transfer efficienvy to micro-droplets, using MSP's foundational expertise in aerosol science, fluid mechanics and vaporization soecifically for the semiconductor industry. For almost two years extensive droplet atomization and evaporation models were studied; a variety of designs were evaluated, developed and extensively tested.

The result of these efforts was the ability to increase vapor out by 200 %, while reducing the size of the heat exchanger by 50 %; Moore’s law demonstrated in vaporization technology.

Difficult (and Easy) to Vaporize Liquids

The MSP Turbo II™ Vaporizers accommodate a diverse range of liquids critical for semiconductor manufacturing, from high ƙ dielectrics to gap-fill deposition processes. Its flexibility and precision are particularly advantageous for vaporizing challenging precursors with low vapor pressures, where maintaining optimal concentration levels without thermal decomposition is crucial. This capability supports enhanced process reliability and performance, ensuring consistent production of advanced semiconductor devices with minimized material waste and improved yield rates.

Frequently asked questions

Q. What are the standard methods for vaporizing a liquid?

The following vaporization techniques are widely utilized in various industries for vapor phase processes such as semiconductor manufacturing:

Direct Liquid Injection (DLI): Liquid is injected into a heated chamber where it vaporizes upon contact with a hot surface.
Flow Over Vapor (FOV): Liquid flows over a heated surface to evaporate into vapor.
Bubblers: Liquids are heated to generate vapors which bubble through the liquid.
Ampoules: Sealed containers heated to vaporize liquid contents.

Q. What are the benefits of using a carrier gas for vapor delivery?

The use of a carrier gas for the vapor supply offers significant advantages: It improves evaporation efficiency by driving liquid vapor, accelerates evaporation for immediate use, reduces risk of condensation in the downstream equipment by maintaining a higher partial vapor pressure, and speeds delivery to the chamber for uniform deposition. This method improves process control and efficiency in semiconductor manufacturing and other vapor deposition applications.

Q. How can vaporization affect semiconductor processes?

Efficient vaporization reduces processing times, downtime, and particle issues. Faster vapor delivery boosts throughput, while stable vapor conditions minimize wafer-to-wafer variation and within-wafer variation. Contactless vaporization with minimized heat load enables use of thermally sensitive precursors, expanding material options for advanced semiconductor manufacturing. These improvements optimize efficiency and enhance product yield across the production cycle.

Q. What is a vapor delivery system (VDS)?

A vapor delivery system (VDS) is critical in semiconductor manufacturing to transport vaporized precursors to processing chambers. It ensures precise control over the deposition of thin films essential for semiconductor device fabrication. VDSs utilize various methods such as direct liquid injection (DLI) to vaporize and deliver materials. They are key to achieving consistent film thickness and quality across semiconductor wafers, thereby contributing to the reliability and performance of microelectronic devices.

Q. What is the maximum and minimum vapor concentration that can be delivered in a vapor delivery system?

Maximum vapor concentrations in a vapor delivery system (VDS) depend on factors like liquid type, downstream pressure, vaporizer temperature, carrier gas type, flow rate, and vaporizer hardware. There isn't a practical minimum concentration, as most vaporizers and delivery methods can handle very low vapor concentrations effectively. Direct Liquid Injection (DLI) systems specify minimum vapor delivery flow rates based on the LFC max flow rate and turn-down ratio.

Q. What are the key criteria for specifying a vapor delivery system in semiconductor manufacturing?

When selecting a vapor delivery system (VDS), focus on these criteria: maximum vapor concentration suitable for your needs, as well as precision, stability and adjustability of the vapor concentration, maintenance requirements and lifespan of the vaporizer, versatility to handle various liquid types, and a proven track record of particle-free vapor delivery in semiconductor manufacturing environments. Choosing wisely ensures efficient processes and consistent, reliable performance.

Q. What are the primary thin film deposition techniques in semiconductor manufacturing?

Thin film deposition techniques in semiconductor manufacturing include Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), Physical Vapor Deposition (PVD), and Molecular Beam Epitaxy (MBE). Each technique offers unique advantages suited to different material properties and device requirements in semiconductor fabrication.

Q. What is the difference between ALD and CVD?

ALD deposits materials atom-by-atom through sequential self-limiting reactions, ensuring precise layering and excellent conformality for ultra-thin films and complex structures. CVD, in contrast, deposits materials in a continuous process from precursor gases, offering versatility for thicker films and a wider range of materials. ALD focuses on atomic precision, while CVD provides efficiency and flexibility in semiconductor manufacturing.

Q. How does ALD deposition work?

Atomic Layer Deposition (ALD) involves sequentially exposing a substrate to gaseous precursors in a controlled environment. Each precursor reaction is self-limiting, depositing a single atomic layer at a time. After each cycle, excess precursors and by-products are purged. This process ensures precise control over film thickness, uniformity, and conformality, making ALD ideal for nanoscale applications in semiconductor manufacturing. --> Read Customer Story How to Revolutionize Your ALD Process

Achieve a Breakthrough for Cobalt Thin-Film Deposition

A Customer Story with MSP

MSP transformed cobalt thin-film deposition for a global semiconductor giant struggling with CCTBA vaporization, including low vapor pressure and thermal instability, leading to clogging and downtime.

Read Customer Story

Liquid Source Vaporization in Gas-Phase Processing

Thin Film Deposition & Removal

Advanced Vaporization Technology

Frequently asked questions

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