Search

Flow Rate 0.1 CFM (2.83 L/min) / Particle Size Range 0.3 to 25 µm

Designed specifically for leading edge microelectronic applications, the Turbo™ Liquid Flow Controllers 2950V pair with MSP's Turbo II™ Vaporizers to provide unmatched liquid source vapor delivery performance for semiconductor thin film deposition processes (including CVD...

Flow Rate 1.0 CFM (28.3 L/min) / Particle Size Range 0.100 to 10.0 µm

MSP's Turbo II™ Vaporizer 2852NP is designed for applications that require low to mid vapor flow rates. Based off of the field proven, highly reliable, and low-maintenance MSP Turbo™ Vaporizers, the new 2852NP provides stable vapor concentrations while maintaining a very small...

MSP's SPx Calibration Standards are precision engineered tools for the calibration, verification and re-qualification of the most common wafer surface inspection systems used in semiconductor manufacturing. These standards play a crucial role in ensuring the accuracy and...

While wet methods are simpler and handle larger particles well, dry deposition provides better particle size accuracy, uniform distribution, and eliminates liquid residuals that can compromise measurement integrity in precision applications.

Understanding the sources of particle shedding and impacts on yield is essential for effective mitigation strategies.

From the meticulous assembly of satellites and spacecraft to the intricate fabrication of composite materials for jet engines, every step demands seamless integration of cutting-edge technology and expert craftsmanship, based on precision and reliability. Avionics systems...

The 2821 MSP Turbo™ Vaporizer is our highest liquid flow rate unit. This model features 2400W of heater power and can be used to deliver flow rates up to 6000g/hr (TEOS or equivalent).