Characterize and optimize the sensitivity and overall performance of your reticle inspection/metrology system with Dev-Dep™ Development Reticle (Photomask) Contamination Standards from MSP, a Division of TSI. These high-quality reticle contamination standards are made to your specifications with quick turnaround, enabling short learning cycles during tool and process development.
Particles smaller than 1.6 µm (1600 nm) are deposited with advanced particle generation and the DMA technology of MSP's Particle Deposition Systems, which is designed for best-in-class deposition of micro-particles and nanoparticles. The modal diameter of deposited nanoparticles is controlled with nanometer-level accuracy and sub-nanometer resolution. Particles larger than 1.6 µm, up to 20 µm, are deposited with newly-developed large-particle generation technology.
Every substrate is handled with extreme care and packaged with MSP's signature triple-wrap packaging, preventing contamination during transport.
Deposit Patterns
Particles can be deposited in Spot and Full (Blanket) patterns with standard processing. Arc and Ring pattern types are available with non-standard processing.
Particle Materials/Types
Particle size standards available for deposition include PSL (polystyrene latex) spheres and SiO2 spheres (NanoSilica™ Size Standards are best-in-class SiO2 size standards offered only by MSP). MSP Process Particles™ Suspensions are material standards currently offered in 14 materials for deposition.
Reticle (Photomask) Types
Reticles of all types (both optical and EUV) that are 6 inch x 6 inch x 1/4 inch in size (6025) can be readily processed with MSP's particle deposition tools. Contact MSP if interested in processing other reticle sizes. These types include:
- Quartz Blank (Optical, EUV)
- Metal, Oxide, Nitride Film (Optical, EUV)
- Resist Coated (Optical, EUV)
- Patterned (Optical, EUV)
Customers typically provide the reticle of their choice, but MSP also provides optical photomask blanks.
Reticle Contamination Standard Base Items
The Dev-Dep™ Development Reticle Contamination Standard (base item) consists of one deposit on a reticle (with triple-wrap packaging) and complete documentation (Deposition Summary, Certificate of Conformance, Certificate of Calibration) for each particle size standard.
| Particle Material | Standard Base Item Deposit Patterns | ||
|---|---|---|---|
| 10 nm to <20 nm | 20 nm to 3 µm* | >3 µm to 20 µm* | |
| PSL Spheres | N/A | Spot, Full | Spot |
| SiO2 Spheres | Spot, Full | Spot, Full | Spot |
| Process Particles** | N/A | Spot, Full | N/A |
* Particles larger than 1.6 µm are not processed with DMA technology.
** Process Particles are available in limited size ranges, which are dependent on particle material.
Additional Deposits
Individual deposits can be added to the base item to create a Dev-Dep™ Development Reticle Contamination Standard with virtually any number of particle deposits.
| Particle Material | Additional Deposit Patterns | ||
|---|---|---|---|
| 10 nm to <20 nm | 20 nm to 3 µm* | >3 µm to 20 µm* | |
| PSL Spheres | N/A | Spot | Spot |
| SiO2 Spheres | Spot | Spot | Spot |
| Process Particles** | N/A | Spot | N/A |
* Particles larger than 1.6 µm are not processed with DMA technology.
** Process Particles are available in limited size ranges, which are dependent on particle material.
Witness Wafers
To validate reticle deposition processing, MSP deposits particles on a 'Witness Wafer' before depositing on the reticle using the same deposition recipe. The Witness Wafer (200 mm or 300 mm) is inspected using a Scanning Surface Inspection System (SSIS) with ~35 nm sensitivity (KLA Surfscan® SP2).
Each Witness Wafer comes with a Deposition Summary, which includes SSIS inspection results (Report Only). At additional cost, the Witness Wafer can be shipped to the customer (Report & Ship).
For particle size <80 nm (PSL light-scattering-equivalent), a 300 mm Witness Wafer is recommended because 300 mm wafers generally have lower background counts at small sizes and provide better inspection signal-to-noise than 200 mm wafers. For larger particle sizes, 200 mm wafers are more cost-effective.
Wafer Inspection
MSP inspects 200 mm or 300 mm bare silicon witness wafers with particles using a Scanning Surface Inspection System (SSIS) with ~35 nm sensitivity (KLA Surfscan® SP2). Inspection results are provided in the Deposition Summary that accompanies the reticle contamination standard, including a scan image with particle size information and approximate count for each deposit.
Features & Benefits
- Totally customized solution based on customer requirements
- Accommodates unique/challenging requirements
- Consultation on application
- Quick turnaround for faster learning
- Widest available range of particle materials and sizes
- Over 100 particle size standards available
- Customizable deposit patterns and locations
- Particle size control with nanometer-level accuracy for nanoparticles
- Consistent particle size with sub-nanometer resolution for nanoparticles
- Particle count from 100 to millions per deposit
- Triple-wrap packaging for low-adder transport
Applications
- Reticle (photomask) inspection tool development
- Reticle (photomask) inspection tool performance characterization
- Reticle (photomask) inspection tool traceable calibration
- Reticle (photomask) inspection process development
- Incoming mask blank inspection
Surfscan is a registered trademark of KLA Corporation.
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