19th International Conference on Planarization/CMP Technology (ICPT 2024)

TSI will be exhibiting at the 19th International Conference on Planarization/CMP Technology (ICPT 2024), where global experts in CMP and planarization technologies come together to exchange the latest research and advancements. Taking place Oct 16-18, this event is the premier platform for academic researchers, industrial practitioners, and engineers.

Poster Presentation

"High-Resolution Size Distribution Characterization of CMP Slurry Particles"
This presentation introduces the a groundbreaking aerosol metrology system designed for the semiconductor industry. It offers unprecedented accuracy in measuring CMP slurry particle size distributions, detecting particles as small as 20 nm, and providing detailed data to reduce waste and improve process control. Learn how aerosol metrology surpasses traditional liquid-phase techniques, ensuring better slurry performance and more reliable outcomes in CMP processes.

Why Visit TSI at ICPT 2024

TSI will present our cutting-edge solution for characterizing CMP slurry, including the 3938 Scanning Mobility Particle Sizer (SMPS™) and 3482 Electrospray Aerosol Generator, designed to enhance your planarization processes:

• Optimize Your CMP Slurry Processes with Particle Precision
  • Reliable Slurry Analysis Data: Achieve more consistent and accurate results for CMP slurry particle size distribution.
  • Cutting-edge Metrology Solutions: Our advanced system helps you optimize CMP process control and improve performance in FEOL, BEOL, TSV, and packaging applications.

TSI’s metrology solutions provide precise and reliable data to improve slurry composition and performance, helping reduce defects and enhance process efficiency.

Discover how our CMP solutions can optimize your processes - visit TSI at ICPT 2024 to learn more!