The Model 2300G3M Particle Deposition System offers best-in-class performance for deposition of particle size standards (including MSP NanoSilica™ Size Standards) on bare, film, and patterned wafers. Using advanced particle generation and Differential Mobility Analyzer (DMA) technology, the 2300G3M controls the modal diameter of deposited particles with sub-nanometer repeatability and SI traceability for demanding metrology applications in semiconductor manufacturing. With the capacity for 16 particle suspensions and a DMA-mode operating range of 20 nm to 2 µm, virtually any inspection tool calibration curve can be generated via deposition with a single automated recipe.
Applications
- Traceable inspection system calibration
- Matching legacy wafer contamination standards
- Incoming bare wafer inspection/qualification
- Determining inspection sensitivity for proprietary films
- Blanket film monitoring
- Inspection tool development and qualification
- Process tool qualification, process learning and monitoring
Features and benefits
- Full (blanket), Spot, Arc, and Ring deposit patterns
- Precise recipe control of deposited particle size
- Nanoparticle atomization for clean particle generation to 20 nm
- DMA size classification for narrow size distribution selection
- Minimization of particle clusters and residue particles
- Recipe control of deposit pattern width
- Recipe, deposition, and suspension analysis reports
- Ergonomic design
- Worldwide service and support
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