Product Details
The Model 2300G3A Particle Deposition System offers best-in-class performance for deposition of particle size standards (including MSP NanoSilica™ Size Standards) on bare, film, and patterned wafers. Using advanced particle generation and Differential Mobility Analyzer (DMA) technology, the 2300G3A controls the modal diameter of deposited particles with sub-nanometer repeatability and SI traceability for demanding metrology applications in semiconductor manufacturing. With the capacity for 16 particle suspensions and a DMA-mode operating range of 10 nm to 2 µm, virtually any inspection tool calibration curve can be generated via deposition with a single automated recipe.
Applications
- Traceable inspection system calibration
- Matching legacy wafer contamination standards
- Incoming bare wafer inspection/qualification
- Determining inspection sensitivity for proprietary films
- Blanket film monitoring
- Inspection tool development and qualification
- Process tool qualification, process learning and monitoring
Features and benefits
- Full (blanket), Spot, Arc, and Ring deposit patterns
- Precise recipe control of deposited particle size
- Nanoparticle atomization for clean particle generation to 10nm
- DMA size classification for narrow size distribution selection
- Minimization of particle clusters and residue particles
- Recipe control of deposit pattern width
- Recipe, deposition, and suspension analysis reports
- Ergonomic design
- Worldwide service and support
Advancing Semiconductor Inspection Tools: Precision 10nm Particle DepositionIdentification and classification of defects as small as 10 nm are essential for maintaining high yields and quality. Detecting such tiny defects poses significant challenges. Learn how to overcome these challenges. |