Product Details
The Model 2300G3A Particle Deposition System offers best-in-class performance for deposition of particle size standards (including MSP NanoSilica™ Size Standards) on bare, film, and patterned wafers. Using advanced particle generation and Differential Mobility Analyzer (DMA) technology, the 2300G3A controls the modal diameter of deposited particles with sub-nanometer repeatability and SI traceability for demanding metrology applications in semiconductor manufacturing. With the capacity for 16 particle suspensions and a DMA-mode operating range of 10 nm to 2 µm, virtually any inspection tool calibration curve can be generated via deposition with a single automated recipe.
Applications
- Traceable inspection system calibration
 - Matching legacy wafer contamination standards
 - Incoming bare wafer inspection/qualification
 - Determining inspection sensitivity for proprietary films
 - Blanket film monitoring
 - Inspection tool development and qualification
 - Process tool qualification, process learning and monitoring
 
Features and benefits
- Full (blanket), Spot, Arc, and Ring deposit patterns
 - Precise recipe control of deposited particle size
 - Nanoparticle atomization for clean particle generation to 10nm
 - DMA size classification for narrow size distribution selection
 - Minimization of particle clusters and residue particles
 - Recipe control of deposit pattern width
 - Recipe, deposition, and suspension analysis reports
 - Ergonomic design
 - Worldwide service and support
 
			
			 |