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Wafer and Reticle Inspection Standards

Improving your Surface Inspection Vision

*Diese Seite ist leider nur in Englisch verfügbar.*

High-quality surface defect calibration standards improve overall performance of your inspection systems and reduce inconsistencies within your inspection tool fleet. MSP’s calibration standards are leaders in the industry for consistent and repeatable particle size and count control.

MSP provides certified Wafer and Photomask (Reticle) Calibration Standards for calibrating, qualifying, and monitoring wafer and photomask inspection systems. Particles of specified size, composition, and count are deposited on your substrate of choice, including wafers, 6-inch photomasks (any type), or HDD disks. Particles can be deposited on bare, film, and patterned wafers from 100mm to 450mm.

Accurate and Traceable. Precise and Repeatable. Faster Learning.

Our Differential Mobility Analyzers (DMA) precisely control the mode (peak) of, and variation in, deposited particle diameter. DMAs are calibrated with SI traceability using the best available particle size reference materials, including PSL spheres from NIST.

MSP’s particle size (10nm to 20μm) and count (400 to >100,000 particles per deposit) are extremely repeatable from substrate to substrate. Spot diameter (typically 10-30mm) and spot location are consistent from deposit to deposit (adjustable with sub-millimeter precision).

Our quick substrate processing speed means your calibration standards are returned to you swiftly. The faster the turnaround, the shorter your learning cycle, and the faster your product can be developed.

MSP’s Wafer and Photomask (Reticle) Calibration Standards meet today’s inspection and metrology applications, including:

  • Incoming bare wafer inspection/qualification
  • Process tool qualification and monitoring
  • Blanket film monitoring
  • Incoming photomask inspection/qualification
  • Production photomask monitoring
  • Inspection tool development and qualification


The particles of specified size, composition, and count are deposited on a bare silicon wafer or your substrate of choice.

Substrate Type Substrate Sizes Supplied by MSP Substrate Sizes Supplied by Customer
Silicon Wafer 150mm, 200mm, 300mm 100 mm, 450 mm
Film Wafer N/A 100 mm, 150 mm, 200 mm,
300 mm, 450 mm
Glass Wafer 200m, 300mm 100 mm, 150 mm, 450 mm
Photomask 6 inch x 6 inch x 1/4 inch (blank photomask only) 6 inch x 6 inch x 1/4 inch (all photomask types)
Glass Disk N/A 65 mm, 95 mm
HDD Disk N/A 95 mm


Attribute Available Options or Ranges
Pattern Type Spot, Full, Arc, Ring
Particle Type/Material
  • PSL Size Standards
  • SiO2 Size Standards
  • MSP Process ParticlesTM Suspensions (Al2O3, AlF3, Cu, Ni, Si, SiO2, Si3N4, Ta, Ti, TiO2, TiN, W, Y2O3)
Particle Size 10 nm - 20 μm
Particle Count Minimum 100 particles per deposit
Pattern Width Typically 10-30 mm. Range of Pattern Width (e.g. Spot Diameter) is dependent on Particle Size


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