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MSP deposits particle size standards on 200 mm and 300 mm low-haze bare silicon wafers with accurate control of particle size and particle count to produce Cal-Dep™ Calibration Wafer Contamination Standards. These certified standards for wafer inspection tools are highly accurate, price-competitive standards built with well-defined, industry-accepted recipes. They ensure your wafer inspection system is performing within your specifications, which helps you to maximize yield.
Modal diameters of PSL and SiO2 size standards that match OEM calibration points of common legacy wafer inspection/metrology systems are controlled with SI traceability using MSP, a Division of TSI, Differential Mobility Analyzer (DMA) technology. MSP deposits its own line of SiO2 spheres (MSP NanoSilica Size Standards) up to a nominal size of 200 nm. SiO2 size standards larger than 200 nm and all PSL size standards are sourced from other suppliers. Most size standards have certified mean or modal diameters measured with SI traceability. When particles without traceability are used, application of SI-traceable DMA calibrations and proper DMA control provide the desired SI traceability.
MSP inspects all 200 mm and 300 mm bare silicon wafers before and after particle deposition using a Scanning Surface Inspection System (SSIS) with ~35 nm sensitivity (KLA Surfscan SP2). Inspection results are provided in the Deposition Summary that accompanies the wafer contamination standard, including a scan image with particle size information and approximate count for each deposit.
Each Cal-Dep™ Calibration Wafer Contamination Standard includes a Certificate of Conformance and a Deposition Summary with SSIS Scan results. For each certified size standard, a copy of the Certificate of Calibration and Traceability from the manufacturer is provided.
Every substrate is handled with extreme care and packaged with MSP's signature triple-wrap packaging, preventing contamination during transport.
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