To meet the increasing demands that IAQ professional...
TSI will be hosting a virtual demonstration of our 3...
This webinar includes pre-recorded videos that demon...
It's full speed ahead for 2021! The San Diego Chapte...
High-quality surface defect calibration standards improve your inspection systems’ sensitivity and overall performance and reduce inconsistencies within your inspection tool fleet. MSP’s calibration standards are leaders in the industry for consistent and repeatable particle size and count control.
MSP provides certified Wafer and Photomask (Reticle) Calibration Standards for calibrating, qualifying, and monitoring wafer and photomask inspection systems. Particles of specified size, composition, and count are deposited on a bare silicon wafer or your substrate of choice, including wafers, HDD disks, or photomasks (any type). Particles can be deposited on bare, film, and patterned wafers from 100mm to 450mm.
Our Differential Mobility Analyzers (DMA) precisely control the mode (peak) of, and variation in, deposited particle diameter. DMAs are calibrated with SI traceability using the best available particle size reference materials, including PSL spheres from NIST.
MSP’s particle size (10nm to 20μm) and count (400 to >100,000 particles per deposit) are extremely repeatable from substrate to substrate. Spot diameter (typically 10-30mm) and spot location are consistent from deposit to deposit (adjustable with sub-millimeter precision).
Our quick substrate processing speed means your calibration standards are returned to you swiftly. The faster the turnaround, the faster your learning cycle, and the faster your product can be developed.
MSP’s Wafer and Photomask (Reticle) Calibration Standards meet today’s metrology applications, including:
The particles of specified size, composition, and count are deposited on a bare silicon wafer or your substrate of choice.