Manual-Load 30 nm Particle Deposition System 2300G3M – 30nm

Product Details

The Model 2300G3M Particle Deposition System offers best-in-class performance for deposition of particle size standards (including MSP NanoSilica™ Size Standards) on bare, film, and patterned wafers. Using advanced particle generation and Differential Mobility Analyzer (DMA) technology, the 2300G3M controls the modal diameter of deposited particles with sub-nanometer repeatability and SI traceability for demanding metrology applications in semiconductor manufacturing. With the capacity for 16 particle suspensions and a DMA-mode operating range of 30 nm to 2 µm, virtually any inspection tool calibration curve can be generated via deposition with a single automated recipe.

Applications

• Traceable inspection system calibration
• Matching legacy wafer contamination standards
• Incoming bare wafer inspection/qualification
• Determining inspection sensitivity for proprietary films
• Blanket film monitoring
• Inspection tool development and qualification
• Process tool qualification, process learning and monitoring

Features and benefits

• Full (blanket), Spot, Arc, and Ring deposit patterns
• Precise recipe control of deposited particle size
• Nanoparticle atomization for clean particle generation to 30 nm
• DMA size classification for narrow size distribution selection
• Minimization of particle clusters and residue particles
• Recipe control of deposit pattern width
• Recipe, deposition, and suspension analysis reports
• Ergonomic design
• Worldwide service and support