Reducing CVD Defects with Post-Vaporization Filtration

Chemical Vapor Deposition (along with ALD and other sub-sets of CVD like PECVD and MOCVD) is one of the most important steps in microelectronic device fabrication. Defects are a costly problem during this phase but some defects are preventable. 

MSP, a Division of TSI, expert Kathy Erickson's new white paper explains how the filtration method used after liquid vaporization in semiconductor manufacturing can:

• Reduce CVD (chemical vapor deposition) defects
• Increase mean time before maintenance, and
• Enable lower pressure plasma-enhanced processes.

Please fill out the form below to download our white paper, "CVD Risk Mitigation: Decrease Defect Density and Increase Mean Time Between Maintenance (MTBM) with More Effective Filtration."