Particle Deposition Systems
Today's Standards for Tomorrow's Yield
MSP’s 2300G3 Particle Deposition System sets the standards for wafer and reticle inspection and metrology equipment. This advanced tool is vital for increasing the yield of leading-edge devices in years to come, while meeting the measurement needs of today.
The 2300G3 Particle Deposition System deposits PSL spheres, MSP’s NanoSilica™ Size Standards, and other SiO2 particles to produce standards with SI traceability. These standards calibrate and qualify your wafer inspection and reticle inspection tools for use in semiconductor device manufacturing.
Deposited particle size and count are controlled with precision, accuracy, and repeatability so the calibration standards are consistent from substrate to substrate.
The Model 2300G3 also deposits particles generated from MSP Process Particles™ Suspensions to help characterize the material dependence of inspection/metrology tool response to defects.
MSP’s 2300G3 Particle Deposition System meets today’s measurement applications, including:
Particle Size Range (Two Versions)
Particle Size Accuracy
(Not including uncertainty intrinsic to the particle reference materials used for calibration of the DMAs.)
This manually-loaded particle deposition system deposits PSL and SiO2 spheres as...
This fully automated particle deposition system deposits PSL and SiO2 spheres as...