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Choose one of the three sessions that works best in your time zone.
The semiconductor industry is continually driving advances in performance while scaling back on size. This expectation of doing more with less is not exclusive to chip design. The semiconductor manufacturing industry is also demanding higher performance solutions with smaller footprints, lower total cost of ownership (TCO) and less waste from their equipment suppliers.
Join us to discuss the science of liquid source vaporization in the context of advanced semiconductor processing. We’ll review the unique challenges that state-of-the art chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes pose to liquid source vaporization, and we will introduce the NEW MSP Turbo II™ Vapor Delivery System designed for semiconductor applications that can deliver twice the vapor output in a foot print that is half the size, while also delivering a lower cost of ownership and reducing liquid waste.
During this webinar, you will learn:
If you need more information, please get in contact with us thorugh tsi.com/MSP-Turbo-II.
Kathy Erickson (Sr. Global Product Manager) has a background in Material Science and Engineering from the University of Minnesota. She began her career in the semiconductor industry as a R&D process engineer at Applied Materials in Santa Clara, California, where she became the primary inventor on a patent for a germanium doped BPSG dielectric layer reflow process. She transitioned into the field of aerosol science with TSI Incorporated in Shoreview, MN, and in 2018 moved to MSP, a Division of TSI®, to focus on liquid source vaporization for the semiconductor industry. Kathy has authored and presented multiple journal articles and conference presentations on a wide variety of aerosol science and semiconductor process related topics.