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When it comes to the testing of parts cleanliness in semiconductor manufacturing, precision matters. Parts such as regulators, mass flow controllers, fittings, valves, tubing, foups, and point of use (POA) filters, etc. can potentially shed particles into process gas lines. This creates a hazard within the manufacturing process because these particles can lead to defects.
Precise testing of parts cleanliness not only safeguards product performance and integrity, but also supports efficiency, compliance, innovation, and sustainability. As the industry continues to evolve, precise parts cleanliness testing is vital, supporting the advancement of critical semiconductor technology.
TSI is the key supplier to enable all the detection solutions you need – down to 100 nm, 10 nm, and 2 nm. We provide the instrument measurement capabilities you need to prevent even the smallest contaminants from causing significant defects while upholding the highest quality standards. Parts cleanliness has significant implications for your semiconductor manufacturing processes (e.g., cleanroom compliance, final product quality) – and must be addressed.
When choosing a measurement tool for monitoring process gas quality, your decision is guided by three key specifications: particle size, false count rate, and flow rate.
Particle Size: Critical defect sizes may differ for different processes; in some situations, detection down to 100 nm is sufficient, while in others, sub-10 nm detection is a pressing need
False Count Rate: Data accuracy is foundational to making decisions and taking actions. In the case of particle counting, a low zero-count rate in an instrument signifies high data accuracy and minimizes the risk of false alarms, thereby enhancing the efficiency of the manufacturing process.
Flow Rate: A higher sampling flow rate is valuable in process gas because the process gas is so clean. With very few particles available to test, statistics becomes a consideration. Higher flow rate instruments, taking in a higher volumetric flow rate of the gas under test, will encounter a greater number of particles. This results in better counting statistics – ensuring that your data is out of the ‘noise’ – so that you can make critical decisions.
By integrating our state-of-the-art airborne particle detection technology into your semiconductor manufacturing processes, you're making a strategic investment in quality, efficiency, and risk reduction. By leveraging decades of industry experience and offering the detection solutions you need – down to 100 nm, 10 nm, and 2 nm – TSI provides the technology to significantly minimize defects, malfunction, or failure – saving you time and money.
Ready to take the next step in elevating your semiconductor manufacturing process? Contact us today to clarify questions or request a quote, and discover how our cutting-edge airborne particles solution can drive your success.