Validate and Optimize Your Cleaning Systems with Reliable PRE Testing

MSP’s Particle Removal Efficiency (PRE) Challenge Wafer Standards provide a trusted solution for validating and optimizing wafer surface cleaning in the semiconductor wafer manufacturing process. Designed for semiconductor fabs, cleaning OEMs, and process engineers, our standards support process development, yield optimization, factory/site acceptance testing, tool validation, requalification after maintenance, and the creation of customized semiconductor cleaning process recipes.
 

Why PRE Standards Matter in Semiconductor Manufacturing

Traditional methods of validationg semiconductor cleaning processes, such as chemical bath monitoring, do not accurately reflect actual wafer particle contamination. As advanced cleaning methods—cryogenic, airbrush, mechanical, and plasma—become more widely adopted, quantifying wafer surface cleaning performance with prevision is essential.

MSP’s dry deposited PRE Standards enable fabs to confidently evaluate and improve the semiconductor wafer manufacturing process. These standards offer precise, repeatable, and industry-proven data to assess cleaning performance across a variety of semiconductor tools and cleaning methods.
 

Ensure Peak Cleaning Performance in Your Semiconductor Fab

Outdated validation tools can lead to inconsistencies and missed defects in the semiconductor cleaning process. MSP’s PRE Challenge Wafers ensure consistent, reliable, and high-resolution validation of wafer surface cleaning—critical for yield enhancement and process control in modern fabs.

Contact us today to learn how PRE Challenge Wafer Standards can help maximize your cleaning efficiency and strengthen your semiconductor wafer manufacturing process.