Deposition of these Process Particles™ on wafers and reticles enables characterization of the material-dependent response of a surface inspection system when accurate particle size or particle sphericity are of secondary importance. They consist of broad size distributions of irregularly shaped solid particles suspended in ultra-pure water (UPW). Each bottle contains a suspension volume of 100 mL.
Process Particles Suspensions have size distributions that facilitate DMA classification of particle size with minimal generation of multiply-charged particles, thereby enhancing size uniformity. They’re formulated for immediate use in MSP Particle Deposition Systems, although moderate dilution may help minimize multiply-charged particles.
Process Particles are also used for characterization of particle removal efficiency (PRE) by wafer and photomask cleaning systems. For such applications, Process Particles may be deposited using the dry process (electrophoresis) of MSP Particle Deposition Systems, which allows for size classification, or they may be applied with a wet process such as spin coating, without size classification.
Process Particles Suspensions are available in three different nominal size ranges:
- 40–200 nm (PR1)
- 200–500 nm (PR2)
- 500–1000 nm (PR3)
Number size distributions are characterized over these respective size ranges using differential mobility analysis, results of which are provided in a certificate. However, particles smaller and larger than these limits are generally present in each suspension.
Process Particles have a nominal shelf life of six (6) months, but are typically observed to be stable for longer durations. No surfactants or other additives are used, thereby minimizing generation of residue particles.
Features and Benefits
- Representative of real-world contaminant particles
- Formulated for immediate use in MSP Particle Deposition Systems
- Size distributions designed for DMA size classification
- No additives
- Easy to use
Applications
- Wafer and reticle (photomask) inspection tool development and qualification
- Particle removal efficiency (PRE) testing of wafer and photomask cleaning systems
Process Particles are currently available in 13 materials, all of which are available in the PR1 size range. Availability of PR2 and PR3 size ranges are indicated for each material in the following selection chart.
| Model | Description | Material |
|---|---|---|
| 2250-02-1032 | AL2O3-PR1 40–200 nm 100 mL | Aluminum Oxide |
| 2250-02-1017 | AL2O3-PR2 200–500 nm 100 mL | Aluminum Oxide |
| 2250-02-1025 | AL2O3-PR3 500–1000 nm 100 mL | Aluminum Oxide |
| 2250-02-1043 | ALF3-PR1 40–200 nm 100 mL | Aluminum Fluoride |
| 2250-02-1029 | CU-PR1 40–200 nm 100 mL | Copper |
| 2250-02-1031 | CU-PR2 200–500 nm 100 mL | Copper |
| 2250-02-1045 | NI-PR1 40–200 nm 100 mL | Nickel |
| 2250-02-1005 | SI-PR1 40–200 nm 100 mL | Silicon |
| 2250-02-1018 | SI-PR2 200–500 nm 100 mL | Silicon |
| 2250-02-1026 | SI-PR3 500–1000 nm 100 mL | Silicon |
| 2250-02-1013 | SI3N4-PR1 40–200 nm 100 mL | Silicon Nitride |
| 2250-02-1020 | SI3N4-PR2 200–500 nm 100 mL | Silicon Nitride |
| 2250-02-1028 | SI3N4-PR3 500–1000 nm 100 mL | Silicon Nitride |
| 2250-02-1033 | SIO2-PR1 40–200 nm 100 mL | Silicon Oxide |
| 2250-02-1019 | SIO2-PR2 200–500 nm 100 mL | Silicon Oxide |
| 2250-02-1027 | SIO2-PR3 500–1000 nm 100 mL | Silicon Oxide |
| 2250-02-1030 | TA-PR1 40–200 nm 100 mL | Tantalum |
| 2250-02-1014 | TI-PR1 40–200 nm 100 mL | Tantalum |
| 2250-02-1021 | TI-PR2 200–500 nm 100 mL | Titanium |
| 2250-02-1016 | TIN-PR1 40–200 nm 100 mL | Titanium Nitride |
| 2250-02-1023 | TIN-PR2 200–500 nm 100 mL | Titanium Nitride |
| 2250-02-1015 | TIO2-PR1 40–200 nm 100 mL | Titanium Oxide |
| 2250-02-1022 | TIO2-PR2 200–500 nm 100 mL | Titanium Oxide |
| 2250-02-1006 | W-PR1 40–200 nm 100 mL | Tungsten |
| 2250-02-1024 | W-PR2 200–500 nm 100 mL | Tungsten |
| 2250-02-1046 | Y2O3-PR1 40–200 nm 100 mL | Yttrium Oxide |
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