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Advanced System for Producing Wafer Contamination Standards

Particle Deposition Systems

MSP's Particle Deposition Systems set the benchmark for wafer inspection and metrology. It enhances the yield of cutting-edge devices and meets today’s measurement requirements.

The systems deposit PSL spheres, MSP’s NanoSilica™ Size Standards, and SiO2 particles, producing precise and reliable contamination standards with SI traceability. These standards calibrate and qualify wafer inspection tools for semiconductor manufacturing.

Particle size and count are precisely controlled, ensuring consistent contamination standards across substrates. The 2300G3 also uses MSP Process Particles™ suspensions to evaluate tool response to defect-related material variations.

Applicable to All Models:
  • Particle Types: PSL spheres/MSP NanoSilica™ Size Standards/MSP Process Particles™ Suspensions
  • Particle Size Range: 10-2,000 nm/20-2,000 nm/30-2,000 nm, DMA-classified
  • Particle Size Accuracy: ±0.5 nm (Dp ≤ 50 nm), ±1% of peak diameter (Dp > 50 nm)
(Not including uncertainty intrinsic to the particle reference materials used for calibration of the DMAs.)

Produits

Auto-Load 20 nm Particle Deposition System 2300G3A - 20 nm

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Manual-Load 20 nm Particle Deposition System 2300G3M - 20nm

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Auto-Load 10 nm Particle Deposition System 2300G3A - 10 nm

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Manual-Load 10 nm Particle Deposition System 2300G3M - 10 nm

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Manual-Load 30 nm Particle Deposition System 2300G3M – 30nm

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The Gold Standard for Inspection Tool Calibration

To trust the results of a wafer inspection system, you must first trust its calibration. MSP Particle Deposition Systems provide the technology needed to create high-quality reference standards in-house. By depositing particles with NIST-traceable accuracy, these systems allow fabs and equipment manufacturers to verify the sensitivity and accuracy of their scanning tools. This capability is vital for setting baselines, matching tools across different locations, and ensuring that defect detection algorithms are performing as expected.

Versatility in Particle Types and Sizes

Modern inspection challenges require versatile solutions. MSP systems can deposit a wide variety of particle types, including Polystyrene Latex (PSL) spheres, NanoSilica™, and process particles. This flexibility allows engineers to simulate real-world contamination scenarios, moving beyond simple calibration to true process-specific qualification. Whether you need to deposit a specific count of 30 nm particles or a broad distribution for cleaning efficiency testing, MSP systems offer the control required to meet rigorous specifications.

Enhancing Yield Management

Accurate inspection leads to better yield management. By utilizing precise contamination standards, engineers can fine-tune inspection recipes to distinguish between killer defects and nuisance noise. This optimization helps reduce false positives and ensures that critical defects are flagged for review. Consequently, MSP Particle Deposition Systems play a supporting role in the overall yield enhancement strategy, providing the reliable standards necessary to maintain high-performance metrology operations.


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