Advanced System for Producing Wafer Contamination Standards

Particle Deposition Systems

MSP's Particle Deposition Systems set the benchmark for wafer inspection and metrology. It enhances the yield of cutting-edge devices and meets today’s measurement requirements.

The systems deposit PSL spheres, MSP’s NanoSilica™ Size Standards, and SiO₂ particles, producing precise and reliable contamination standards with SI traceability. These standards calibrate and qualify wafer inspection tools for semiconductor manufacturing.

Particle size and count are precisely controlled, ensuring consistent contamination standards across substrates. The 2300G3 also uses MSP Process Particles™ suspensions to evaluate tool response to defect-related material variations.

Applicable to All Models:

Particle Types: PSL spheres/MSP NanoSilica™ Size Standards/MSP Process Particles™ Suspensions
Particle Size Range: 10-2,000 nm/20-2,000 nm/30-2,000 nm, DMA-classified
Particle Size Accuracy: ±0.5 nm (D_p ≤ 50 nm), ±1% of peak diameter (D_p> 50 nm)

(Not including uncertainty intrinsic to the particle reference materials used for calibration of the DMAs.)

产品

Auto-Load 20 nm Particle Deposition System 2300G3A - 20 nm

This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm...

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Manual-Load 20 nm Particle Deposition System 2300G3M - 20nm

This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 20 nm...

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Auto-Load 10 nm Particle Deposition System 2300G3A - 10 nm

This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm...

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Manual-Load 10 nm Particle Deposition System 2300G3M - 10 nm

This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 10 nm...

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Manual-Load 30 nm Particle Deposition System 2300G3M – 30nm

This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 30 nm...

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