2026 International Symposium on Chemical-Mechanical Planarization (CMP)

2026/8/2 - 2026/8/5 Lake Placid, New York https://sites.clarkson.edu/camp/2026-camp-cmp-symposium/

TSI is pleased to participate in the 2026 International Symposium on Chemical-Mechanical Planarization (CMP), organized by Clarkson University and the Northern California Chapter of the AVS CMP User Group. This annual symposium brings together leading experts from industry, academia, and research institutes to discuss the latest advances in CMP science, slurry development, metrology, defect reduction, post-CMP cleaning, and emerging semiconductor applications.

Technical Presentation

Fig. 1. SMPS particle size distribution (PSD) for a slurry being monitored during concentration variation and subsequent stabilization phase. 📅 Date: Wednesday, 5 August
🕦 Time: 10:40 AM
📍 Session H "Particle Characterization and Modeling in CMP"

TSI Application Engineer Dan Troolin will present about "Continuous and stable CMP abrasive sizing and concentration monitoring using aerosol metrology", demonstrating how mobility-based particle sizing provides a more complete view of abrasive particle populations than traditional optical techniques.

Attendees will learn how improved particle characterization can help:

Resolve multimodal particle size distributions
Detect sub-20 nm fines and agglomerates beyond the limits of optical methods
Better understand slurry performance and process consistency
Support optimization of CMP processes through more representative particle measurements

Visit TSI

As semiconductor devices continue to scale, understanding the complete particle size distribution of CMP slurries becomes increasingly important for process optimization and defect reduction. TSI will showcase advanced particle characterization solutions designed to provide researchers and process engineers with deeper insight into slurry performance.

Our measurement approach delivers more accurate abrasive particle size distributions, resolving the full multimodal particle size distribution—including sub-20 nm fines and agglomerate tails that conventional optical methods cannot detect. This enables a more complete understanding of slurry behavior and supports improved process control.

We Look Forward to Seeing You

Whether you're developing next-generation CMP slurries, optimizing polishing processes, or advancing semiconductor manufacturing, we invite you to connect with the TSI team during the symposium. We look forward to discussing how our nanoparticle characterization solutions can help you gain deeper insight into your slurry systems and support the next generation of semiconductor innovation.