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粒子沉积系统

粒子沉积系统

MSP’s 2300G3 Particle Deposition System sets the standards for wafer and reticle inspection and metrology equipment. This advanced tool is vital for increasing the yield of leading-edge devices in years to come, while meeting the measurement needs of today.

Accurate. Repeatable. Consistent.

The 2300G3 Particle Deposition System deposits PSL spheres, MSP’s NanoSilica™ Size Standards, and other SiO2 particles to produce standards with SI traceability. These standards calibrate and qualify your wafer inspection and reticle inspection tools for use in semiconductor device manufacturing.

Deposited particle size and count are controlled with precision, accuracy, and repeatability so the calibration standards are consistent from substrate to substrate.

The Model 2300G3 also deposits particles generated from MSP Process Particles™ Suspensions to help characterize the material dependence of inspection/metrology tool response to defects.

Features and Benefits

Full (blanket), Spot, Arc, and Ring deposit patterns
Precise recipe control of deposited particle size
Nanoparticle atomization for clean particle generation down to 10nm
Differential Mobility Analyzer (DMA) size classification for narrow size distribution selection
Minimization of particle clusters and residue particles
Recipe control of deposit pattern width
Recipe, deposition, and suspension analysis reports
Ergonomic design
Worldwide service and support

Applications

MSP’s 2300G3 Particle Deposition System meets today’s measurement applications, including:

Incoming bare wafer inspection/qualification
Process tool qualification and monitoring
Blanket film monitoring
Incoming reticle inspection/qualification
Production reticle monitoring
Inspection tool development and qualification

Find the right model

Model	Substrate Loading	Supported Substrates	Particle Size Range
2300G3A - 20 nm (2332)	Automatic	200 mm wafers (optional) 300 mm wafers	20 nm - 2 µm
2300G3M - 20 nm (2333)	Manual	15 mm wafers 200 mm wafers 300 mm wafers 6 inch reticles/photomasks	20 nm - 2 µm
2300G3A - 10 nm (2334)	Automatic	200 mm wafers (optional) 300 mm wafers	10 nm - 2 µm
2300G3M - 10 nm (2335)	Manual	150 mm wafers 200 mm wafers 300 mm wafers 6 inch reticles/photomasks	10 nm - 2 µm

Applicable to Both Models

Particle Types

PSL spheres
MSP NanoSilica™ Size Standards
MSP Process Particles™ Suspensions

Particle Size Range (Two Versions)

10nm to 2000nm, DMA-classified
20nm to 2000nm, DMA-classified

Particle Size Accuracy

±0.5nm (Dp≤50nm)
±1% of peak diameter (Dp>50nm)

(Not including uncertainty intrinsic to the particle reference materials used for calibration of the DMAs.)

									
Auto-Load 20 nm Particle Deposition System 2300G3A - 20 nm

										This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm contamination standards. Robotic wafer handling allows up to 25 wafers to be processed in a single control job, increasing productivity in your metrology operations and improving product yield.

Manual-Load 20 nm Particle Deposition System 2300G3M - 20nm

										This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom contamination standards. Manual loading allows a wide range of substrates to be deposited including 150 mm, 200 mm, and 300 mm wafers, supporting of all of your wafer metrology applications and improving product yield.

Auto-Load 10 nm Particle Deposition System 2300G3A - 10 nm

										This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm contamination standards. Robotic wafer handling allows up to 25 wafers to be processed in a single control job, increasing productivity in your metrology operations and improving product yield.

Manual-Load 10 nm Particle Deposition System 2300G3M - 10 nm

										This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom contamination standards. Manual loading allows a wide range of substrates to be deposited including 150 mm, 200 mm, and 300 mm wafers, supporting of all of your wafer metrology applications and improving product yield.

Manual-Load 30 nm Particle Deposition System 2300G3M – 30nm

										This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 30 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom contamination standards. Manual loading allows a wide range of substrates to be deposited including 150 mm, 200 mm, and 300 mm wafers, supporting of all of your wafer metrology applications and improving product yield.