Wafer & Reticle Contamination Standards

Accurate and Traceable. Precise and Repeatable.

Our Differential Mobility Analyzers (DMA) precisely control the mode (peak) of, and variation in, deposited particle diameter. DMAs are calibrated with SI traceability using the best available particle size reference materials, including PSL spheres from NIST.

MSP’s particle size (10 nm to 20 μm) and count (400 to >100,000 particles per deposit) are extremely repeatable from substrate to substrate. Spot diameter (typically 10-30 mm) and spot location are consistent from deposit to deposit (adjustable with sub-millimeter precision).

Our quick substrate processing speed means your contamination standards are returned to you swiftly. The faster the turnaround, the faster your product can be developed, qualified, and calibrated.

MSP’s Wafer and Reticle Contamination Standards meet today’s inspection and metrology applications, including:

• Traceable calibration and matching legacy calibration standards
• Incoming bare wafer inspection/qualification
• Blanket film monitoring
• Incoming reticle inspection/qualification
• Production reticle monitoring
• Inspection tool development and qualification
• Process tool qualification and monitoring