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Particle Deposition Systems

Today's Standards for Tomorrow's Yield

MSP’s 2300G3 Particle Deposition System sets the standards for wafer and reticle inspection and metrology equipment. This advanced tool is vital for increasing the yield of leading-edge devices in years to come, while meeting the measurement needs of today.

Accurate. Repeatable. Consistent.

The 2300G3 Particle Deposition System deposits PSL spheres, MSP’s NanoSilica™ Size Standards, and other SiO2 particles to produce standards with SI traceability. These standards calibrate and qualify your wafer inspection and reticle inspection tools for use in semiconductor device manufacturing.

Deposited particle size and count are controlled with precision, accuracy, and repeatability so the calibration standards are consistent from substrate to substrate.

The Model 2300G3 also deposits particles generated from MSP Process Particles™ Suspensions to help characterize the material dependence of inspection/metrology tool response to defects.

Features and Benefits

  • Full (blanket), Spot, Arc, and Ring deposit patterns
  • Precise recipe control of deposited particle size
  • Nanoparticle atomization for clean particle generation down to 10nm
  • Differential Mobility Analyzer (DMA) size classification for narrow size distribution selection
  • Minimization of particle clusters and residue particles
  • Recipe control of deposit pattern width
  • Recipe, deposition, and suspension analysis reports
  • Ergonomic design
  • Worldwide service and support

Applications

MSP’s 2300G3 Particle Deposition System meets today’s measurement applications, including:

  • Incoming bare wafer inspection/qualification
  • Process tool qualification and monitoring
  • Blanket film monitoring
  • Incoming reticle inspection/qualification
  • Production reticle monitoring
  • Inspection tool development and qualification

Find the right model

Model Substrate Loading Supported Substrates Particle Size Range
2300G3A - 20 nm (2332) Automatic 200 mm wafers (optional)
300 mm wafers
20 nm - 2 µm
2300G3M - 20 nm (2333) Manual 15 mm wafers
200 mm wafers
300 mm wafers
6 inch reticles/photomasks
20 nm - 2 µm
2300G3A - 10 nm (2334) Automatic 200 mm wafers (optional)
300 mm wafers
10 nm - 2 µm
2300G3M - 10 nm (2335) Manual 150 mm wafers
200 mm wafers
300 mm wafers
6 inch reticles/photomasks
10 nm - 2 µm

 

Applicable to Both Models

Particle Types

  • PSL spheres
  • MSP NanoSilica™ Size Standards
  • MSP Process Particles™ Suspensions

Particle Size Range (Two Versions)

  • 10nm to 2000nm, DMA-classified
  • 20nm to 2000nm, DMA-classified

Particle Size Accuracy

  • ±0.5nm (Dp≤50nm)
  • ±1% of peak diameter (Dp>50nm)

(Not including uncertainty intrinsic to the particle reference materials used for calibration of the DMAs.)

Manual-Load 30 nm Particle Deposition System 2300G3M – 30nm

This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 30 nm...

Manual-Load 10 nm Particle Deposition System 2300G3M - 10 nm

This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 10 nm...

Auto-Load 10 nm Particle Deposition System 2300G3A - 10 nm

This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm...

Manual-Load 20 nm Particle Deposition System 2300G3M - 20nm

This manually-loaded particle deposition system deposits PSL and SiO2 spheres as small as 20 nm...

Auto-Load 20 nm Particle Deposition System 2300G3A - 20 nm

This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm...

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