Wafer slurry being polished

CMP Slurry Characterization Using the Scanning Mobility Particle Sizer (SMPS) with TSI Generator

Application Note About Silica Slurry

Fig. 4. TEM image of silica slurry abrasive particles attached to a substrate (branch-like structure).Summary: Aerosolization combined with Scanning Mobility Particle Sizing (SMPS) provides an accurate, high-resolution method for measuring the particle size distribution (PSD) of Chemical Mechanical Planarization (CMP) slurries. Unlike dynamic light scattering (DLS), which is biased toward larger particles and has difficulty resolving multiple size populations, the Nano LPM™ Generator + SMPS technique aerosolizes a diluted slurry sample and measures individual dried particles by electrical mobility — identifying distinct particle size peaks in about 2 minutes per scan. This method has been validated against NIST-traceable polystyrene latex (PSL) standards and confirmed by TEM image analysis, making it suited for CMP slurry R&D, QA/QC, and inline process monitoring.

Table of Contents:Preview of application note

  1. What Is CMP Slurry and Why Does Particle Size Distribution Matter?
  2. How Is CMP Slurry Particle Size Measured Today? TEM, SEM, and DLS Compared
  3. Aerosolization + SMPS: A More Accurate Way to Measure CMP Slurry Particle Size
  4. Validating Accuracy with NIST-Traceable Polystyrene Latex (PSL) Standard Particles
  5. Silica CMP Slurry Case Study: Nano LPM™ Generator+SMPS vs. DLS vs. TEM Results
  6. Conclusion: Why Nano LPM™ Generator+SMPS Is a Gold-Standard Method for CMP Slurry Particle Sizing
  7. References

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Peer-Reviewed Journal Articles About CMP Slurry Characterization

Discover publications demonstrating the benefits of aerosolization and Scanning Mobility Particle Sizer (SMPS) for CMP slurry analysis.

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